-37%

Gigabyte Z790 Z790 UD AX WIFI Gaming Motherboard, Black

24,499.00
287 people are viewing this right now
Estimated Delivery:
Feb 27 - 05 Mar, 2024
Trust Badge
Guaranteed safe & secure checkout

Description

Gigabyte Z790 UD AX WIFI Gaming Motherboard

Gigabyte Z790 UD AX WIFI.

Features:

  • Supports Intel® Core™ 14th/ 13th /12th processors
  • Unparalleled Performance:Twin 16*+1+1 Phases Digital VRM Solution
  • Dual Channel DDR5:4*SMD DIMMs with XMP 3.0 Memory Module Support
  • Next Generation Storage:3*PCIe 4.0 x4 M.2 Connectors
  • Advanced Thermal Design & M.2 Thermal Guard: To Ensure VRM Power Stability & M.2 SSD Performance
  • EZ-Latch Plus:PCIe 5.0 x16 Slot with Quick Release & Screwless Design
  • Fast Networks:2.5GbE LAN & Wi-Fi 6E 802.11ax
  • Extended Connectivity:DP, HDMI, Front USB-C® 5Gb/s, Rear USB-C® 20Gb/s
  • Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
  • Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card

* 8+8 phases parallel power design

UNPARALLELED PERFORMANCE

With the fast-moving technology changes, GIGABYTE always follows the latest trends and provides customers with advanced features and latest technologies. GIGABYTE motherboards are equipped with upgraded power solution, latest storage standards and outstanding connectivity to enable optimized performance for gaming.

Outstanding Thermal Design

GIGABYTE Motherboards’ Un-throttled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming performance.

CONNECTIVITY

GIGABYTE Motherboards enable the ultimate connection experience with blazing data-transfer speeds through the next generation network, storage, and Wi-Fi connectivity.

PERSONALIZATION

GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.

ULTRA DURABLE

GIGABYTE Ultra Durable™ design provides product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.

Front Panel USB-C Connector

The USB 3.2 Gen 2 port has a throughput up to 10 Gb/s while connected to USB 3.2 compliant peripherals. With the USB Type-C connector, users can enjoy the flexibility of a reversible connection to access and store massive amounts of data rapidly.

Design Ready for PCIe 5.0

PCIe 5.0 Design supports double the bandwidth of PCIe 4.0 and ensures that compatible with cutting-edge SSDs and GPUs released in the next few years to their full capability.

XMP 3.0 User Profile

Define and create your own SPD profile into Native and XMP 3.0 memory modules or apply the pre-tuned profiles to XMP 3.0 User Profile. Two user-defined profiles can be saved, loaded either locally or from/to an external storage device.
• Two empty SPD profiles can be defined by users and carry to next computer
• Transfer DDR5 XMP Booster profiles into XMP 3.0 User Profiles
• Quick memory performance simulation based on user input clock and timing parameters
• Profile save and load function to share your memory parameters online

GIGABYTE PerfDrive

PerfDrive technology integrates multiple GIGABYTE exclusive BIOS settings to allow users to balance between different levels of performance, power consumption, and temperature according to their needs easily when using 13th gen Intel® Core™ processors.

Nanocarbon Coated Fin Array Heatsink

As CPUs get more powerful, VRM modules get hotter under ultra high performance. Being the first adopters among industry using NanoCarbon as coating material to enhance thermal radiation speed up heat dissipation. Nanocarbon is coated onto the heatsink through electrostatic adhesion. The coating material covers the entire finned heatsink with 200μm in thickness. In that way, heat is dissipated more quickly. The tests show 10% cooler with the NanoCarbon coating.

Fins-Array III

GIGABYTE new generation Fins-Array III delivers the ultimate thermal performance by using Extended Irregular fins to fill all available space and vastly increases surface area. A piece of Fins-Array III heatsink surface area is larger than 2 full size ATX motherboard PCB, therefore it tremendously boost thermal efficiency and heat exchange performance.

M.2 Thermal Guard III

M.2 Thermal Guard III constructed with 9X optimized heat dissipation surface to prevent throttling and bottleneck that high-speed/ large capacity of PCIe 5.0 M.2 SSDs may cause, especially under heavy workload.

Select the fields to be shown. Others will be hidden. Drag and drop to rearrange the order.
  • Image
  • SKU
  • Rating
  • Price
  • Stock
  • Description
  • Weight
  • Dimensions
  • Additional information
  • Add to cart
Click outside to hide the comparison bar
Compare
0
0